A brand new analysis paper titled “Simulating Power and Safety Interactions in Semiconductor Manufacturing: Insights from the Intel Minifab Mannequin” was revealed by researchers at Idaho Nationwide Laboratory, College of Texas at Austin, College of Texas at San Antonio and George Mason College.

Summary:
“Semiconductor manufacturing is a extremely complicated. Fabrication crops should cope with re-entrant flows to assist a number of varieties of wafers being produced concurrently, every with their very own deadlines and specs. The manufacturing course of itself relies upon upon the power to regulate and programmatically alter quite a lot of environmental circumstances together with temperature, humidity, and air high quality. As well as, wafer fabrication consumes giant quantities of electrical energy. Rising applied sciences could assist cut back the power footprint of such amenities however can introduce cybersecurity dangers. Due to this fact, this paper presents a modeling and simulation framework to quantify tradeoffs between operational measures of efficiency, power consumption, and cybersecurity controls. We increase the Intel Minifab mannequin, with the Purdue Enterprise Reference Structure (PERA) for cybersecurity in addition to tool-level power consumption knowledge from a real-world semiconductor manufacturing testbed. On this method, we intend to supply stakeholders with a scientific, data-driven method to guage rising dangers throughout the manufacturing course of.”

Discover the technical paper here and here. Printed November 2022.

Quotation: Weaver, Gabriel A, Hasenbein, John J., Kutanoglu, Erhan, Martinez-Medina, Gonzalo, Shusko, Jacob William, Castillo-Villar, Krystel Ok., and Costa, Paulo Cesar. Simulating Power and Safety Interactions in Semiconductor Manufacturing: Insights from the Intel Minifab Mannequin. United States: N. p., 2022. Internet.



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