Indium Company and SAFI-Tech have introduced the launch of a brand new supercooled BiSn solder paste utilizing SAFI-Tech’s progressive solder platform.
Utilizing SAFI-Tech’s platform, liquid metallic is encapsulated in a proprietary mushy shell, holding the solder alloy in a sub-cooled (liquid) state far beneath its regular melting/freezing level. The shell of those powder-like microcapsules might be eliminated utilizing a standard flux and reflow course of, or burst by compression.
SAFI-Tech’s supercooled BiSn solder paste might be fluxed and reflowed at 135°C, a temperature that’s at present inconceivable to succeed in utilizing typical BiSn solder alloys.
Goal functions embody versatile hybrid electronics and heat-sensitive functions at present utilizing conductive epoxies.
SAFI-Tech’s CTO and President Ian Tevis mentioned, “We’re excited to work with Indium Company on the discharge of our supercooled BiSn product. Indium Company’s community of shoppers and gear suppliers will enable us to deliver supercooled solder to market.”
Indium Company President and COO Ross Berntson mentioned, “SAFI-Tech’s platform is altering the way in which during which the electronics business can use solder. Their BiSn product will enable clients to create totally metallic, electrically conductive joints in functions the place that is at present not potential.”
SAFI-Tech and Indium Company are at present sending their supercooled BiSn solder product to events for testing.