A technical paper titled “Price-Conscious Exploration for Chiplet-Primarily based Structure with Superior Packaging Applied sciences” was printed by researchers at UCSB, College of California, Santa Barbara.

Summary:
“The chiplet-based System-in-Package deal~(SiP) know-how allows extra design flexibility through numerous inter-chiplet connection and heterogeneous integration. Nonetheless, it isn’t recognized the way to convert such flexibility into value effectivity, which is important when making a design choice. On this paper, we develop an analytical value mannequin that may estimate the price of the two.5D chiplet-based SiP methods beneath numerous interconnection choices and know-how nodes. We performed two case research utilizing our value mannequin to discover the associated fee traits of the two.5D chiplet-based SiP system. Primarily based on the case research, we made a number of observations on the interposer choice, design partition granularity, and know-how node adoption for cost-efficient chiplet-based SiP design.”

Discover the technical paper here. Printed June 2022.

arXiv:2206.07308v1. Authors: Tianqi Tang, Yuan Xie.

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