Attaining 3D sensing for semiconductor bump top uniformity is crucial earlier than including photoresist. However there are challenges in utilizing conventional strategies for measuring uniformity after copper plating, which requires a mix of 3D fringe projection know-how and NanoResolution inspection and metrology.

Right here’s what we’ve realized in a bump top uniformity case research:

Subodh Kulkarni

Subodh Kulkarni

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Subodh Kulkarni is the president and CEO of CyberOptics.



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